| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| QL6325-4PS516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
| QL6325-5PS516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
| QL6325-6PS516I | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -40°C | 85°C | 1 M |
| QL6325-6PS516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
| QL6325-7PS516I | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -40°C | 85°C | 1 M |
| QL6325-7PS516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
| WEDPS512K32-12BC | 12ns; 5V power supply; 512K x 32 SRAM multi-chip package | distributor | PBGA | 143 | 0°C | 70°C | 156 K |
| WEDPS512K32-15BC | 15ns; 5V power supply; 512K x 32 SRAM multi-chip package | distributor | PBGA | 143 | 0°C | 70°C | 156 K |
| WEDPS512K32-17BC | 17ns; 5V power supply; 512K x 32 SRAM multi-chip package | distributor | PBGA | 143 | 0°C | 70°C | 156 K |
| WEDPS512K32-20BC | 20ns; 5V power supply; 512K x 32 SRAM multi-chip package | distributor | PBGA | 143 | 0°C | 70°C | 156 K |
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