| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MCP6S22
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S22-I/MS
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S22-I/P
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S22-I/SN
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S22T-I/MS
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S22T-I/SN
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| UT54ACS220UCA | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS220UCA | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS220UCC | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS220UCC | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| << [40] [41] [42] [43] [44] 45 |
|---|
