| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MCP6S28
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S28-I/MS
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S28-I/P
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| MCP6S28-I/SN
| Single-Ended, Rail-to-Rail I-O, Low Gain | Microchip-Technology-Inc- | - | | - | - | 687 K |
| UT54ACTS283PCA | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
| UT54ACTS283PCC | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
| UT54ACTS283PCX | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
| UT54ACTS283UCC | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
| UT54ACTS283UCX | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
| UT54ACTS283UCX | RadHard MSI. 4-bit binary full adder. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
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