| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| BSP123 | N-channel SIPMOS small-signal transistor | Infineon-formely-Siemens | - | 4 | -55°C | 150°C | 160 K |
| BSP125 | N-channel SIPMOS small-signal transistor | Infineon-formely-Siemens | - | 4 | -55°C | 150°C | 175 K |
| BSP129 | N-channel SIPMOS small-signal transistor | Infineon-formely-Siemens | - | 4 | -55°C | 150°C | 321 K |
| SVSP1A684M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | - | - | - | - | 124 K |
| SVSP1C225M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | P CASE | - | - | - | 124 K |
| SVSP1C334M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | - | - | - | - | 124 K |
| SVSP1C335M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | P CASE | - | - | - | 124 K |
| SVSP1C474M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | - | - | - | - | 124 K |
| TESVSP1C225M8R | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | P CASE | - | - | - | 124 K |
| TESVSP1C335M8R | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | P CASE | - | - | - | 124 K |
| [1] [2] 3 [4] [5] [6] [7] [8] [9] [10] |
|---|
