Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CSPST08-220F | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST08-220J | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST08-330F | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST08-330J | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST08-390F | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
FSPS230F | Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs | Intersil-Corporation | - | - | - | - | 80 K |
FSPS230R | Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs | Intersil-Corporation | - | - | - | - | 80 K |
FSPS230R | Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs | Intersil-Corporation | - | - | - | - | 80 K |
OBSPSGDIE | Real Time Clock (RTC) [Not recommended for new designs] | distributor | SB Cerdip | 24 | - | - | 367 K |
UR6HCSPS2-SP40-FG | Converts PS/2 data to serial or SPI | Semtech-Corporation | LQFP | 32 | -40°C | 85°C | 132 K |
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