| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT54ACS04UCA | RadHard MSI. Hex inverter. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS04UCA | RadHard MSI. Hex inverter. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS04UCC | RadHard MSI. Hex inverter. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04PCA | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04PCC | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04PCX | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04PCX | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04UCA | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04UCC | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS04UCX | RadHard MSI. Hex inverter. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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