| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT54ACS10PCA | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10PCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10PCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCX | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11UCA | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| << [639] [640] [641] [642] [643] 644 [645] [646] [647] [648] [649] >> |
|---|
