Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT70824L20G | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 317 K |
IDT70824L25G | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 317 K |
IDT70824L35G | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 317 K |
IDT70824L45G | High-speed 4K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 317 K |
IDT70825S20PF | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 319 K |
IDT70825S25PF | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 319 K |
IDT70825S35PF | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 319 K |
IDT70825S35PFB | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | -55°C | 125°C | 319 K |
IDT70825S45PF | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 319 K |
IDT70825S45PFB | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | TQFP | 80 | -55°C | 125°C | 319 K |
[1] [2] 3 [4] [5] |
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