| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7207L15D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L15J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
| IDT7207L20D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20DB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L20J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
| IDT7207L25D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L30DB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L35D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50DB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
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