| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7207L15P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L25P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L30PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L35P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| [1] [2] 3 |
|---|
