| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| HGTP12N60A4 | 600V, SMPS Series N-Channel IGBT | Intersil-Corporation | - | - | - | - | 115 K |
| HGTP12N60A4D | 600V, SMPS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode | Intersil-Corporation | - | - | - | - | 394 K |
| HGTP12N60B3D | 27A, 600V, UFS Series N-Channel IGBTs with Anti-Parallel Hyperfast Diode | Intersil-Corporation | - | - | - | - | 117 K |
| HGTP12N60B3D | 27A, 600V, UFS Series N-Channel IGBTs with Anti-Parallel Hyperfast Diode | Intersil-Corporation | - | - | - | - | 117 K |
| MTP12N10E | TMOS E-FET power field effect transistor | Motorola | - | 4 | -55°C | 170°C | 239 K |
| MTP12P10 | Power field effect transistor | Motorola | - | 4 | -65°C | 150°C | 190 K |
| OR3TP12-6BA256 | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | PBGA | 256 | 0°C | 70°C | 2 M |
| OR3TP12-6BA256I | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | PBGA | 256 | -40°C | 85°C | 2 M |
| OR3TP12-6BA352 | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-/64-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | PBGA | 352 | 0°C | 70°C | 2 M |
| OR3TP12-6PS240 | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | SQFP | 240 | 0°C | 70°C | 2 M |
| OR3TP12-6PS240I | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | SQFP | 240 | -40°C | 85°C | 2 M |
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