Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT54ACTS27UCA | RadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACTS27UCC | RadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACTS27UCC | RadHard MSI. Triple 3-input NOR. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACTS34PCA | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACTS34PCA | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACTS34PCC | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACTS34PCC | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACTS34PCX | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACTS34UCA | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACTS34UCC | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACTS34UCX | RadHard MSI. Hex noninverting buffer. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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