| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AT17LV256-10JC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PLCC | 20 | 0°C | 70°C | 149 K |
| AT17LV256-10JI | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PLCC | 20 | -40°C | 85°C | 149 K |
| AT17LV256-10PC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PDIP | 8 | 0°C | 70°C | 149 K |
| AT17LV256-10PI | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PDIP | 8 | -40°C | 85°C | 149 K |
| AT17LV256-10SC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | SOIC | 20 | 0°C | 70°C | 149 K |
| AT28LV256-25JI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | PLCC | 32 | -40°C | 85°C | 602 K |
| AT28LV256-25PI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | PDIP | 28 | -40°C | 85°C | 602 K |
| AT28LV256-25SI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | SOIC | 28 | -40°C | 85°C | 602 K |
| AT28LV256-25TC | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | TSOP | 28 | 0°C | 70°C | 602 K |
| AT28LV256-25TI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | TSOP | 28 | -40°C | 85°C | 602 K |
| << [25] [26] [27] [28] [29] 30 [31] [32] [33] [34] [35] >> |
|---|
