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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT22VP10T-15PPARadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder.distributorDIP24--287 K
UT22VP10T-15PPCRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold.distributorDIP24--287 K
UT22VP10T-15PPXRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional.distributorDIP24--287 K
UT22VP10T-15PPXRadiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional.distributorDIP24--287 K
UT22VP10T-20PPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.distributorDIP24--287 K
UT22VP10T-20PPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.distributorDIP24--287 K
UT22VP10T-20PPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.distributorDIP24--287 K
UT22VP10T-20UPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.distributorFlatPack24--287 K
UT22VP10T-20UPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.distributorFlatPack24--287 K
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
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