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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT22VP10C-20WPCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold.distributorQuad flatpack28--287 K
UT22VP10C-20WPCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold.distributorQuad flatpack28--287 K
UT22VP10C-20WPXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
UT22VP10C-20WPXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
UT22VP10C-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorDIP24--287 K
UT22VP10C-25PPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorDIP24--287 K
UT22VP10C-25UPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorFlatPack24--287 K
UT22VP10C-25UPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.distributorFlatPack24--287 K
UT22VP10C-25WPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.distributorQuad flatpack28--287 K
UT22VP10C-25WPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.distributorQuad flatpack28--287 K
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