| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CY37064VP100-100AC | 3.3V, ISR high-performance CPLDs, 64 macrocells, 100MHz | Cypress-Semiconductor | TQFP | 100 | 0°C | 70°C | 1 M |
| CY37064VP100-100AI | 3.3V, ISR high-performance CPLDs, 64 macrocells, 100MHz | Cypress-Semiconductor | TQFP | 100 | -40°C | 85°C | 1 M |
| CY37064VP100-100BBC | 3.3V, ISR high-performance CPLDs, 64 macrocells, 100MHz | Cypress-Semiconductor | BGA | 100 | 0°C | 70°C | 1 M |
| CY37064VP100-100BBI | 3.3V, ISR high-performance CPLDs, 64 macrocells, 100MHz | Cypress-Semiconductor | BGA | 100 | -40°C | 85°C | 1 M |
| CY37128VP100-125AC | 3.3V, ISR high-performance CPLDs, 128 macrocells, 125MHz | Cypress-Semiconductor | TQFP | 100 | 0°C | 70°C | 1 M |
| CY37128VP100-125BBC | 3.3V, ISR high-performance CPLDs, 128 macrocells, 125MHz | Cypress-Semiconductor | BGA | 100 | 0°C | 70°C | 1 M |
| UT22VP10C-20PCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
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