| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10E-15UCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-15WCX | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
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