| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25PCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25UCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25UCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25UCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10E-25WCX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| << [3] [4] [5] [6] [7] 8 [9] [10] [11] [12] [13] >> |
|---|
