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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
FAR-F6CE-1G8800-L2XJ-UPiezoelectric SAW BPF (1000 to 2500 MHz)Fujitsu-MicroelectronisSMT6-30°C85°C428 K
FAR-F6CE-1G8800-L2XJ-WPiezoelectric SAW BPF (1000 to 2500 MHz)Fujitsu-MicroelectronisSMT6-30°C85°C428 K
FAR-F6CE-1G8800-L2XJ-VPiezoelectric SAW BPF (1000 to 2500 MHz)Fujitsu-MicroelectronisSMT6-30°C85°C428 K
MH4M365CNXJ-5Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4M365CNXJ-6Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4M365CNXJ-7Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4M365CXJ-5Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4M365CXJ-6Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4M365CXJ-7Hyper page mode 150994944-bit (4194304- word by 36-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupSOJ720°C70°C224 K
MH4S644AWXJ-5Fast page mode 268435456-bit (4194304- word by 64-bit) dynamic RAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSSOP1680°C70°C171 K
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