| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| Z8400B1 | Z80 CPU central processor unit, 2.5MHz, plastic package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400B6 | Z80 CPU central processor unit, 2.5MHz, plastic package | SGS-Thomson-Microelectronics | - | 40 | -40°C | 85°C | 2 M |
| Z8400BC6 | Z80 CPU central processor unit, 6.0 MHz, plastic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | -40°C | 85°C | 2 M |
| Z8400F1 | Z80 CPU central processor unit, 2.5MHz, frit seal package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400HB6 | Z80 CPU central processor unit, 8.0 MHz, plastic package | SGS-Thomson-Microelectronics | - | 40 | -40°C | 85°C | 2 M |
| Z8400HC1 | Z80 CPU central processor unit, 8.0 MHz, plastic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | 0°C | 70°C | 2 M |
| Z8400HD1 | Z80 CPU central processor unit, 8.0 MHz, ceramic package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400HF1 | Z80 CPU central processor unit, 8.0 MHz, frit seal package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400HK1 | Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | 0°C | 70°C | 2 M |
| Z8400HK6 | Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | -40°C | 85°C | 2 M |
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