| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| Z8400AF1 | Z80 CPU central processor unit, 4.0 MHz, frit seal package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400BC1 | Z80 CPU central processor unit, 6.0 MHz, plastic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | 0°C | 70°C | 2 M |
| Z8400BD2 | Z80 CPU central processor unit, 6.0 MHz, ceramic package | SGS-Thomson-Microelectronics | - | 40 | -55°C | 125°C | 2 M |
| Z8400BD6 | Z80 CPU central processor unit, 6.0 MHz, ceramic package | SGS-Thomson-Microelectronics | - | 40 | -40°C | 85°C | 2 M |
| Z8400BK1 | Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | 0°C | 70°C | 2 M |
| Z8400BK1 | Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | 0°C | 70°C | 2 M |
| Z8400BK2 | Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | -55°C | 125°C | 2 M |
| Z8400BK6 | Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package | SGS-Thomson-Microelectronics | - | 44 | -40°C | 85°C | 2 M |
| Z8400HB1 | Z80 CPU central processor unit, 8.0 MHz, plastic package | SGS-Thomson-Microelectronics | - | 40 | 0°C | 70°C | 2 M |
| Z8400HD6 | Z80 CPU central processor unit, 8.0 MHz, ceramic package | SGS-Thomson-Microelectronics | - | 40 | -40°C | 85°C | 2 M |
| [1] [2] [3] 4 [5] |
|---|
