| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 27C040-20FA | 7 V, 4 MEG CMOS EPROM (512x8) | Philips-Semiconductors | CDIL | 32 | 0°C | 70°C | 481 K |
| 27C040-20FA | 7 V, 4 MEG CMOS EPROM (512x8) | Philips-Semiconductors | CDIL | 32 | 0°C | 70°C | 481 K |
| 27C040-20FA | 7 V, 4 MEG CMOS EPROM (512x8) | Philips-Semiconductors | CDIL | 32 | 0°C | 70°C | 481 K |
| 27C040-20FA | 7 V, 4 MEG CMOS EPROM (512x8) | Philips-Semiconductors | CDIL | 32 | 0°C | 70°C | 481 K |
| ULC0408FC24C | 24.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 172 K |
| ULLC0402FC05C | 5.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC08C | 8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC12C | 12.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC15C | 15.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC24C | 24.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC3.3C | 3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
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