Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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LTC1235CN | Microprocessor supervisory circuit | Linear-Technology | PDIP | 16 | 0°C | 70°C | 252 K |
LTC1235CS | Microprocessor supervisory circuit | Linear-Technology | SOL | 16 | 0°C | 70°C | 252 K |
MC1201A | 4.75-5.25V; advanced multi-axis motion control chipset | distributor | CP | 64 | 0°C | 70°C | 467 K |
MC1231A | 4.75-5.25V; advanced brushless motor control chipset | distributor | CP | 64 | 0°C | 70°C | 474 K |
MC1241A | 4.75-5.25V; advanced brushless motor control chipset | distributor | CP | 64 | 0°C | 70°C | 422 K |
U0408FC12C | 12.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 115 K |
ULC0402FC12C | 12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0402 | - | -55°C | 150°C | 161 K |
ULC0406FC12C | 12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
ULC0408FC12C | 12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 172 K |
ULLC0402FC12C | 12.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
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