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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT54ACS109Radiation-hardened dual J-K flip-flop.distributorDIP16-55°C125°C52 K
UT54ACS109Radiation-hardened dual J-K flip-flop.distributorFlatPack16-55°C125°C52 K
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.distributorCeramic DIP14-55°C125°C15 K
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.distributorCeramic DIP14-55°C125°C15 K
UT54ACS10PCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.distributorCeramic DIP14-55°C125°C15 K
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.distributorCeramic flatpack14-55°C125°C15 K
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.distributorCeramic flatpack14-55°C125°C15 K
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.distributorCeramic flatpack14-55°C125°C15 K
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.distributorCeramic flatpack14-55°C125°C15 K
UT54ACS10UCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.distributorCeramic flatpack14-55°C125°C15 K
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