Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT70T659S008BC | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 8ns | Integrated-Device-Technology-Inc- | BGA | 256 | 0°C | 70°C | 344 K |
IDT70T659S010BC | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 10ns | Integrated-Device-Technology-Inc- | BGA | 256 | 0°C | 70°C | 344 K |
IDT70T659S010BCI | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 10ns | Integrated-Device-Technology-Inc- | BGA | 256 | -40°C | 85°C | 344 K |
IDT70T659S012BC | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 12ns | Integrated-Device-Technology-Inc- | BGA | 256 | 0°C | 70°C | 344 K |
IDT70T659S012BCI | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 12ns | Integrated-Device-Technology-Inc- | BGA | 256 | -40°C | 85°C | 344 K |
IDT70T659S012BFI | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 12ns | Integrated-Device-Technology-Inc- | fpBGA | 208 | -40°C | 85°C | 344 K |
IDT70T659S015BC | High-speed 2.5V 128 x 36 asynchronous dual-port static RAM, 15ns | Integrated-Device-Technology-Inc- | BGA | 256 | 0°C | 70°C | 344 K |
IDT72V36110L10PF | 3.3V, high-density, low power, 131072 x 36-bit FIFO, 10ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
IDT72V36110L15PF | 3.3V, high-density, low power, 131072 x 36-bit FIFO, 15ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
IDT72V36110L7.5PF | 3.3V, high-density, low power, 131072 x 36-bit FIFO, 7.5ns | Integrated-Device-Technology-Inc- | TQFP | 128 | 0°C | 70°C | 567 K |
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