Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7203L120PB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 147 K |
IDT7203L120PB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 147 K |
IDT7203L15P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L20P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L20TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7203L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L25TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7203L35P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L35TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7203L50P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L50TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
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