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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT72V01L25J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V01L35J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V02L25J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V02L35J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V03L25J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V03L35J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V04L25J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V04L35J3.3V volt CMOS asynchronous FIFO 512 x 9, 1024 x 9, 2048 x 9, 4096 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C133 K
IDT72V3640L15PF3.3V, high-density, low power, 1024 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3640L7.5PF3.3V, high-density, low power, 1024 x 36-bit FIFO, 7.5nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
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