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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT72V3640L10PF3.3V, high-density, low power, 1024 x 36-bit FIFO, 10nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3640L15PFI3.3V, high-density, low power, 1024 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP128-40°C85°C567 K
IDT72V3650L10PF3.3V, high-density, low power, 2048 x 36-bit FIFO, 10nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3650L15PF3.3V, high-density, low power, 2048 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3650L15PFI3.3V, high-density, low power, 2048 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP128-40°C85°C567 K
IDT72V3650L7.5PF3.3V, high-density, low power, 2048 x 36-bit FIFO, 7.5nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3660L10PF3.3V, high-density, low power, 4096 x 36-bit FIFO, 10nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3660L15PF3.3V, high-density, low power, 4096 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V3660L15PFI3.3V, high-density, low power, 4096 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP128-40°C85°C567 K
IDT72V3660L7.5PF3.3V, high-density, low power, 4096 x 36-bit FIFO, 7.5nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
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