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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
KM416C1004CJ-451M x 16Bit CMOS dynamic RAM with extended data out, 45ns, VCC=5.0V, refresh period=64msSamsung-ElectronicSOJ420°C70°C804 K
KM416C1004CJ-51M x 16Bit CMOS dynamic RAM with extended data out, 50ns, VCC=5.0V, refresh period=64msSamsung-ElectronicSOJ420°C70°C804 K
KM416C1004CJ-61M x 16Bit CMOS dynamic RAM with extended data out, 60ns, VCC=5.0V, refresh period=64msSamsung-ElectronicSOJ420°C70°C804 K
KM416C1004CJL-51M x 16Bit CMOS dynamic RAM with extended data out, 50ns, VCC=5.0V, self-refreshSamsung-ElectronicSOJ420°C70°C804 K
KM416C1004CJL-61M x 16Bit CMOS dynamic RAM with extended data out, 60ns, VCC=5.0V, self-refreshSamsung-ElectronicSOJ420°C70°C804 K
KM416C1204CJL-501M x 16Bit CMOS dynamic RAM with extended data out, 50ns, VCC=5.0V, self-refreshSamsung-ElectronicSOJ420°C70°C804 K
KM416RD8AC-RK80256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 800 Mbps(400 MHz).Samsung-ElectronicmicroBGA(normal CSP)620°C70°C3 M
KM416RD8AD-RK80256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 800 Mbps(400 MHz).Samsung-ElectronicmicroBGA(mirrored CS620°C70°C3 M
KM416RD8AS-RM80256K x 16 x 32s dependent banks for consumer package. Access time: 40 ns, speed: 800 Mbps(400 MHz).Samsung-ElectronicmicroBGA540°C90°C3 M
KM416RD8AS-SM80256K x 16 x 32s dependent banks for consumer package. Access time: 40 ns, speed: 800 Mbps(400 MHz).Samsung-ElectronicmicroBGA540°C90°C3 M
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