Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT7Q512K-UPC | 512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish gold. | distributor | Ceramic flatpack | 32 | -55°C | 125°C | 107 K |
UT7Q512K-UPC | 512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish gold. | distributor | Ceramic flatpack | 32 | -55°C | 125°C | 107 K |
UT7Q512K-UWC | 512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold. | distributor | Ceramic flatpack | 32 | -40°C | 125°C | 107 K |
UT8Q512-20ICA | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-20ICA | 512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-ICA | 512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512-ICC | 512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Military temperature range flow. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 127 K |
UT8Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
UT8Q512K32-SWC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
UT8Q512K32-SWC | 512K32 16Megabit SRAM MCM. 25ns access time, 3.3V operation. Lead finish gold. | distributor | CQFP | 68 | -40°C | 125°C | 135 K |
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