| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| HB54R5128KN-10B | 512M; 125MHz DDR SDRAM SO-DIMM | distributor | - | 200 | - | - | 514 K |
| HB54R5128KN-B75B | 512M; 133MHz DDR SDRAM SO-DIMM | distributor | - | 200 | - | - | 514 K |
| HVR512 | 1200 V, 5 A, high voltage rectifier diode | distributor | - | 2 | -40°C | 150°C | 16 K |
| M68AR512D | 8 MBIT (512K X16) 1.8V ASYNCHRONOUS SRAM | SGS-Thomson-Microelectronics | - | - | - | - | 140 K |
| MC-4R512FKE6D-840 | 512M; 800MHz direct rambus dynamic RAM SO-RIMM module | distributor | FBGA | - | - | - | 130 K |
| MC-4R512FKE8D-840 | 512M; 800MHz direct rambus dynamic RAM SO-RIMM module | distributor | FBGA | - | - | - | 129 K |
| MC-4R512FKK6K-840 | 512M; 800MHz direct rambus dynamic RAM RIMM module | distributor | FBGA | - | - | - | 91 K |
| MC-4R512FKK8K-840 | 512M; 800MHz direct rambus dynamic RAM module | distributor | FBGA | - | - | - | 91 K |
| UT8R512K8-15UCA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
| UT8R512K8-15UCA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 109 K |
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