| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7202LA120XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7202LA65XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7202LA80XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7207L15P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L25P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L30PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L35P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
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