| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| TA80186 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 394 K |
| TA80188 | High-integration 16-bit microprocessor | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 394 K |
| TA80960CA-16 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CA-25 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-16 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-25 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80960CF-30 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
| TA80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 561 K |
| TA80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 561 K |
| [1] [2] 3 |
|---|
