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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
UT22VP10E-20PCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.distributorDIP24-55°C125°C287 K
UT22VP10E-20PCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.distributorDIP24-55°C125°C287 K
UT22VP10E-20PCXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional.distributorDIP24-55°C125°C287 K
UT22VP10E-25PCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.distributorDIP24-55°C125°C287 K
UT22VP10E-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorDIP24-55°C125°C287 K
UT22VP10E-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorDIP24-55°C125°C287 K
UT22VP10E-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorDIP24-55°C125°C287 K
UT22VP10E-25UCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.distributorFlatPack24-55°C125°C287 K
UT22VP10E-25UCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.distributorFlatPack24-55°C125°C287 K
UT22VP10E-25UCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.distributorFlatPack24-55°C125°C287 K
UT22VP10E-25UCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.distributorFlatPack24-55°C125°C287 K
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