Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT54ACS273PCA | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
UT54ACS273PCC | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
UT54ACS273PCX | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
UT54ACS273UCA | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACS273UCA | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACS273UCC | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACS273UCX | RadHard MSI. Octal D flip-flop with clear. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACTS273UCA | RadHard MSI. Octal D flip-flop with clear. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACTS273UCX | RadHard MSI. Octal D flip-flop with clear. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACTS273UCX | RadHard MSI. Octal D flip-flop with clear. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
UT54ACTS273UCX | RadHard MSI. Octal D flip-flop with clear. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
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