Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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1515-10B | Delay 10 +/-1 ns, fixed SIP delay line Td/Tr=10 | distributor | SIP | 14 | -55°C | 125°C | 31 K |
1517-10B | Delay 10 +/-1 ns, 5-TAP DIP delay line Td/Tr=3 | distributor | DIP | 14 | -55°C | 125°C | 37 K |
1519-10B | Delay 10 +/-1 ns, 10-TAP DIP delay line Td/Tr=5 | distributor | DIP | 16 | -55°C | 125°C | 43 K |
A370-10B | Analog uncooled laser module. Pfiber 1.0 mW. Connector SC-APC. Performance option standard. | distributor | - | 8 | -40°C | 85°C | 157 K |
D370-10B | Digital uncooled laser module. Pfiber 1.0 mW. Connector SC-APC. | distributor | - | 8 | -40°C | 85°C | 53 K |
IS62LV12816L-10B | 128K x 16 CMOS static RAM | distributor | BGA | 48 | 0°C | 70°C | 82 K |
IS62LV12816LL-10B | 128K x 16 CMOS static RAM | distributor | BGA | 48 | 0°C | 70°C | 82 K |
IS82C600-10B | Trailblazer High-speed SRAM with address decoding and ready logic | distributor | PBGA | - | 0°C | 70°C | 129 K |
IS82C600-10BI | Trailblazer High-speed SRAM with address decoding and ready logic | distributor | PBGA | - | -40°C | 85°C | 129 K |
MH4S64CBMD-10B | 268435456 (4194304- word by 64-bit) dynamic RAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 708 K |
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