| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 2020-900 | Delay 900 +/-18 ns, fixed SIP delay line Tr<1ns | distributor | SIP | 8 | -65°C | 125°C | 31 K |
| CSPPT08-900F | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| CSPPT08-900J | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| CSPPT16-900F | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| CSPPT16-900J | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| CSPPT32-900F | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| CSPPT32-900J | Chip scale parallel termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 59 K |
| HS-9008RH | Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter | Intersil-Corporation | - | - | - | - | 193 K |
| MBM29DL400TC-900PFTR | CMOS 4M (512K x 8/256 x 16) bit | Fujitsu-Microelectronis | - | 48 | -40°C | 85°C | 551 K |
| MBM29LV800BA-900PFTR | CMOS 8M (1M x 8/512K x 16) bit | Fujitsu-Microelectronis | plastic TSOP | 48 | -40°C | 85°C | 608 K |
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