Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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100323CW | Low Power Hex Bus Driver | Fairchild-Semiconductor | - | - | - | - | 67 K |
100323DMQB | Low Power Hex Bus Driver | distributor | Cerdip | 24 | - | - | 110 K |
100323FMQB | Low Power Hex Bus Driver | distributor | Cerquad | 24 | - | - | 110 K |
100323PC | Low Power Hex Bus Driver | Fairchild-Semiconductor | MDIP | 24 | - | - | 67 K |
100323QC | Low Power Hex Bus Driver | Fairchild-Semiconductor | PLCC | 28 | - | - | 67 K |
100323QCX | Low Power Hex Bus Driver | Fairchild-Semiconductor | PLCC | 28 | - | - | 67 K |
5962-0323601QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
5962-0323601QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
5962-0323601QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
5962-0323601VXA | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
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