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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
U0406FC05C5.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC12C12.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC3.3C3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
ULC0406FC05C5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
ULC0406FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
ULC0406FC12C12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
ULC0406FC15C15.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
ULC0406FC3.3C3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
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