Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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EH10004Z1 | 3 Phase Bridge | Microsemi-Corporation | SEE_FACTORY | - | - | - | 80 K |
EH10006Z1 | 3 Phase Bridge | Microsemi-Corporation | SEE_FACTORY | - | - | - | 80 K |
EH10008Z1 | 3 Phase Bridge | Microsemi-Corporation | SEE_FACTORY | - | - | - | 80 K |
LSP1000 | PIN Diode | Microsemi-Corporation | EPSM | - | - | - | 322 K |
MSM511000C-45JS | 1,048,576-word x 1-bit dynamic RAM | distributor | SOJ | 26 | 0°C | 70°C | 224 K |
MSM511000C-50JS | 1,048,576-word x 1-bit dynamic RAM | distributor | SOJ | 26 | 0°C | 70°C | 224 K |
MSM511000C-60JS | 1,048,576-word x 1-bit dynamic RAM | distributor | SOJ | 26 | 0°C | 70°C | 224 K |
MXP1000PC-V | Photoconductive Detectors | Microsemi-Corporation | (none) | - | - | - | 266 K |
MXP1000PV-V | Photovoltaic Detectors | Microsemi-Corporation | (none) | - | - | - | 266 K |
XMMA1000P | Micromachined accelerometer | Motorola | PDIP | 16 | -40°C | 85°C | 161 K |
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