Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CD40174BCM | Hex D-Type Flip-Flop | Fairchild-Semiconductor | SOIC | 16 | - | - | 58 K |
CD40174BCMX | Hex D-Type Flip-Flop | Fairchild-Semiconductor | SOIC | 16 | - | - | 58 K |
CD40174BCN | Hex D-Type Flip-Flop | Fairchild-Semiconductor | MDIP | 16 | - | - | 58 K |
CD40174BMS | Radiation Hardened CMOS Hex `D-Type Flip-Flop | Intersil-Corporation | - | - | - | - | 70 K |
MAX174BC/D | Industry standard complete 12-bit A/D converter. 8 microsec. max conversion time. Linearity (LSBs) 1/2. | Maxim-Integrated-Producs | Dice | - | 0°C | 70°C | 559 K |
MAX174BCPI | Industry standard complete 12-bit A/D converter. 8 microsec max conversion time. Linearity (LSBs) 1/2. TEMPCO (ppm/C) 27. | Maxim-Integrated-Producs | Plastic DIP | 28 | 0°C | 70°C | 559 K |
MAX174BCWI | Industry standard complete 12-bit A/D converter. 8 microsec. max conversion time. Linearity (LSBs) 1/2. TEMPCO (ppm/C) 27. | Maxim-Integrated-Producs | Wide SO | 28 | 0°C | 70°C | 559 K |
MAX174BEPI | Industry standard complete 12-bit A/D converter. 8 microsec. max conversion time. Linearity (LSBs) 1/2. TEMPCO(ppm/C) 38. | Maxim-Integrated-Producs | Plastic DIP | 28 | -40°C | 85°C | 559 K |
MAX174BEPI | Industry standard complete 12-bit A/D converter. 8 microsec. max conversion time. Linearity (LSBs) 1/2. TEMPCO(ppm/C) 38. | Maxim-Integrated-Producs | Plastic DIP | 28 | -40°C | 85°C | 559 K |
MAX174BEWI | Industry standard complete 12-bit A/D converter. 8 microsec. max conversion time. Linearity (LSBs) 1/2. TEMPCO(ppm/C) 38. | Maxim-Integrated-Producs | Wide SO | 28 | -40°C | 85°C | 559 K |
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