Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT71321LA55J | High-speed 2K x 8 dual-port static RAM with interrupts | Integrated-Device-Technology-Inc- | PLCC | 52 | 0°C | 70°C | 193 K |
IDT71321LA55TF | High-speed 2K x 8 dual-port static RAM with interrupts | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 193 K |
IDT71421LA55TF | High-speed 2K x 8 dual-port static RAM with interrupts | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 193 K |
IDT7201LA50DB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERDIP | 28 | -55°C | 125°C | 152 K |
IDT7201LA50JB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | -55°C | 125°C | 152 K |
IDT7201LA50LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
IDT7201LA50SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7201LA50TDB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 152 K |
IDT7201LA50TPB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 152 K |
IDT7201LA50XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
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