Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7200LA120SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7200LA20SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7200LA40SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7200LA65SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7200LA80SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT72200L20TPB | CMOS syncFIFO 64K x 8, 256 x8, 512 x 8, 1024 x 8, 2048 x 8 and 4096 x 8 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 163 K |
IDT72200L25TPB | CMOS syncFIFO 64K x 8, 256 x8, 512 x 8, 1024 x 8, 2048 x 8 and 4096 x 8 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 163 K |
IDT72200L35TP | CMOS syncFIFO 64K x 8, 256 x8, 512 x 8, 1024 x 8, 2048 x 8 and 4096 x 8 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 163 K |
IDT72200L50TP | CMOS syncFIFO 64K x 8, 256 x8, 512 x 8, 1024 x 8, 2048 x 8 and 4096 x 8 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 163 K |
IDT72200L50TPB | CMOS syncFIFO 64K x 8, 256 x8, 512 x 8, 1024 x 8, 2048 x 8 and 4096 x 8 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 163 K |
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