Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AT28HC256-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
AT28HC256-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
AT28HC256E-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
AT28HC256E-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
AT28HC256F-12DM/883 | 256(32K x 8) high speed CMOS EPROM | ATMEL-Corporation | ceramic DIP | 28 | -55°C | 125°C | 728 K |
AT28HC256F-12FM/883 | 256(32K x 8) high speed CMOS EPROM | ATMEL-Corporation | Flatpack | 28 | -55°C | 125°C | 728 K |
AT28HC256F-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
AT28HC256F-12TI | 256(32K x 8) high speed CMOS EPROM | ATMEL-Corporation | TSOP | 28 | -40°C | 85°C | 728 K |
AT28HC256F-12UM/883 | 256(32K x 8) high speed CMOS EPROM | ATMEL-Corporation | PGA | 28 | -55°C | 125°C | 728 K |
AT28HC256F-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
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