Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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MC33072AD | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | SOIC | 8 | - | - | 432 K |
MC33072ADR2 | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | SOIC | 8 | - | - | 432 K |
MC33072AP | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | PDIP | 8 | - | - | 432 K |
MC33072D | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | SOIC | 8 | - | - | 432 K |
MC33072DR2 | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | SOIC | 8 | - | - | 432 K |
MC33072P | High Slew Rate, Wide Bandwidth, Single Supply Operational Amplifiers | ON-Semiconductor | PDIP | 8 | - | - | 432 K |
TISP3072F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 415 K |
TISP3072F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 415 K |
TISP3072F3P | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | P | - | - | - | 415 K |
TISP3072F3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 415 K |
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