| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| A23L2616M-100 | 100ns 4M x 16/8M x 8bit CMOS MASK ROM | distributor | SOP | 44 | 0°C | 70°C | 122 K |
| A23L2616M-70 | 70ns 4M x 16/8M x 8bit CMOS MASK ROM | distributor | SOP | 44 | 0°C | 70°C | 122 K |
| A23L2616V-100 | 100ns 4M x 16/8M x 8bit CMOS MASK ROM | distributor | TSOP | 48 | 0°C | 70°C | 122 K |
| A23L2616V-70 | 70ns 4M x 16/8M x 8bit CMOS MASK ROM | distributor | TSOP | 48 | 0°C | 70°C | 122 K |
| IDT7203L20P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT7203L20PB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 147 K |
| IDT7203L20TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
| IDT7203L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT723613L20PF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PF | 120 | 0°C | 70°C | 342 K |
| IDT723613L20PQF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 342 K |
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