Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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MSC23408C-60DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23408C-70DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23408C-80DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23408CL-60DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23408CL-70DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
MSC23408CL-80DS8 | 4,194,304-word x 8-bit DRAM module | distributor | - | 30 | 0°C | 70°C | 554 K |
PACDN1408C | ESD protection array | California-Micro-Devices | Chip scale | 6 | -40°C | 85°C | 51 K |
PACDN2408C | ESD protection array | California-Micro-Devices | Chip scale | 10 | -40°C | 85°C | 747 K |
THS1408CPFB | 14-BIT, 8 MSPS ADC SINGLE CH., DIFF. INPUT, DSP/UP IF, PGMABLE GAIN AMP, INTERNAL S&H | Texas-Instruments | PFB | 48 | 0°C | 70°C | 312 K |
W986408CH | 2M*8bit*4 banks SDRAM | Winbond-Electronics | TSOP54 | 54 | 0°C | 70°C | 2 M |
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