| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 1N5533B | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 83 K |
| 1N5533B | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 83 K |
| 1N5533B | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 81 K |
| 1N5533B-1 | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 81 K |
| 1N5533BBUR-1 | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 81 K |
| 1N5533BUR-1 | Low Voltage Avalanche Zener | Microsemi-Corporation | - | - | - | - | 81 K |
| AS2533BP | Multi-standard CMOS single chip telephone IC with dual soft clipping | Austria-Mikro-Systeme-International | DIP | 28 | -25°C | 70°C | 270 K |
| AS2533BT | Multi-standard CMOS single chip telephone IC with dual soft clipping | Austria-Mikro-Systeme-International | SOIC | 28 | -25°C | 70°C | 270 K |
| MAX533BCEE | 2.7V, low-power, 8-bit quad DAC with Rail-to-Rail output buffer. INL (LSB) +-2 | Maxim-Integrated-Producs | QSOP | 16 | 0°C | 70°C | 146 K |
| MAX533BCPE | 2.7V, low-power, 8-bit quad DAC with Rail-to-Rail output buffer. INL (LSB) +-2 | Maxim-Integrated-Producs | Plastic DIP | 16 | 0°C | 70°C | 146 K |
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