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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MH32V7245BST-52,415,919,104-bit (33,554,432-word by 72-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C138 K
MPC2105BSG66256KB and 1MB burstRAM secondary cache moduleMotorolaGold Pad SIMM1780°C70°C245 K
MSM51V17805BSL-70TS-K2,097,152-word x 8-bit dynamic RAMdistributorTSOP280°C70°C95 K
MSM51V18165BSL-50JS1,048,576-word x 16-bit dynamic RAMdistributorSOJ420°C70°C105 K
MSM51V18165BSL-50TS-K1,048,576-word x 16-bit dynamic RAMdistributorTSOP500°C70°C105 K
MSM51V18165BSL-60JS1,048,576-word x 16-bit dynamic RAMdistributorSOJ420°C70°C105 K
MSM51V18165BSL-60TS-K1,048,576-word x 16-bit dynamic RAMdistributorTSOP500°C70°C105 K
MSM51V18165BSL-70JS1,048,576-word x 16-bit dynamic RAMdistributorSOJ420°C70°C105 K
MSM51V18165BSL-70JS1,048,576-word x 16-bit dynamic RAMdistributorSOJ420°C70°C105 K
MSM51V18165BSL-70TS-K1,048,576-word x 16-bit dynamic RAMdistributorTSOP500°C70°C105 K
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