| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 2211-600D | Delay 600 +/-30 ns, fixed DIP delay line Td/Tr=10 | distributor | DIP | 24 | -55°C | 125°C | -- |
| 2214-600D | Delay 600 +/-30 ns, 20-TAP DIP delay line Td/Tr=10 | distributor | DIP | 24 | -55°C | 125°C | 51 K |
| DIM600DCM17-A000 | 1700V IGBT chopper module | distributor | - | 12 | - | - | 181 K |
| ER1600DC-T3 | 50V, 16A D2PAK surface mount super fast glass passivated rectifier | distributor | DPAK | 3 | -50°C | 150°C | 53 K |
| ER1600DC-T3 | 50V, 16A D2PAK surface mount super fast glass passivated rectifier | distributor | DPAK | 3 | -50°C | 150°C | 53 K |
| P600D | Silicon rectifier.Current 6.0A. Maximum recurrent peak reverse voltage 200V. Maximum RMS voltage 140V. Maximum DC blocking voltage 200V | Wing-Shing-Electronic-Co----manufacturer-of-power-semiconductors | - | 2 | -65°C | 175°C | 344 K |
| P600D | 200V, 6.0A silicon rectifier | distributor | - | 2 | -50°C | 150°C | 36 K |
| P600D | 200V, 6.0A silicon rectifier | distributor | - | 2 | -50°C | 150°C | 36 K |
| PM600DSA060 | 600 Amp intelligent power module for flat-base type insulated package | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 13 | -20°C | 150°C | 62 K |
| PM600DSA060 | 600Amp - intelligent power modules | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | - | - | 925 K |
| PM600DVA060 | 600Amp - intelligent power modules | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | - | - | 925 K |
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